TY - GEN
T1 - A Microstrip Strip Line Based High Dynamic range Optical Front-end for LiDAR Application
AU - Gorre, Pradeep
AU - Samantaray, Aswini Kumar
AU - Sai Kiran, K. M.
AU - Shaik, Bano Rashmi
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This work presents a 180 nm CMOS based transimpedance amplifier (TIA) for time-of-flight (ToF) LiDAR. The proposed design includes a T-shaped microstrip line (MSL) network as first phase, Variable Gain Common Gate (VGCG) Transimpedance as second phase, and a post amplification as final stage. The MSL section reduce the impact of the photodiode capacitance achieving higher bandwidth performance, while the VGCG provides low input impedance and performs current to voltage conversion with high dynamic range (DR). A post amplification stage is integrated at the output of VGCG TIA in order to achieve high gain. The work demonstrates a wide band of 1250 MHz, a maximum transimpedance gain, high DR and an ultra-low noise of 91.42 dBΩ, 71dB, and 3.71 pA/sqrt (Hz). The TIA along with post amplification consumes a power of 33 mW.
AB - This work presents a 180 nm CMOS based transimpedance amplifier (TIA) for time-of-flight (ToF) LiDAR. The proposed design includes a T-shaped microstrip line (MSL) network as first phase, Variable Gain Common Gate (VGCG) Transimpedance as second phase, and a post amplification as final stage. The MSL section reduce the impact of the photodiode capacitance achieving higher bandwidth performance, while the VGCG provides low input impedance and performs current to voltage conversion with high dynamic range (DR). A post amplification stage is integrated at the output of VGCG TIA in order to achieve high gain. The work demonstrates a wide band of 1250 MHz, a maximum transimpedance gain, high DR and an ultra-low noise of 91.42 dBΩ, 71dB, and 3.71 pA/sqrt (Hz). The TIA along with post amplification consumes a power of 33 mW.
UR - https://www.scopus.com/pages/publications/85163152957
UR - https://www.scopus.com/pages/publications/85163152957#tab=citedBy
U2 - 10.1109/AISP57993.2023.10134997
DO - 10.1109/AISP57993.2023.10134997
M3 - Conference contribution
AN - SCOPUS:85163152957
T3 - 2023 3rd International Conference on Artificial Intelligence and Signal Processing, AISP 2023
BT - 2023 3rd International Conference on Artificial Intelligence and Signal Processing, AISP 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Artificial Intelligence and Signal Processing, AISP 2023
Y2 - 18 March 2023 through 20 March 2023
ER -