TY - JOUR
T1 - Characterization of thermally evaporated copper selenide thin films for device applications
AU - Nagappa Moger, Sahana
AU - Mahesha, M. G.
N1 - Funding Information:
The authors are grateful to UGC DAE CSR, Indore, Govt. of India ( CSR–IC–MSRSR-11/CRS-219/2017–18/1300 ) for financial assistance.
Publisher Copyright:
© 2022 Elsevier Ltd. All rights reserved.
PY - 2022
Y1 - 2022
N2 - Copper Selenide thin films were grown by thermal evaporation method on glass substrate. The properties of the thin films were characterized by XRD, UV-Visible spectroscopy, SEM-EDS, and PL analysis. The uniformity and stoichiometry of the deposited films were confirmed by SEM-EDS analysis. The XRD results confirmed the cubic phase with prominent (1 1 1) orientation. The deposited films showed very low transmittance (∼20%) and direct band gap of about 2.35 eV. Further, PL spectra revealed the presence of defect states present in the films. The deposited films are p-type material with carrier density of 1.14 × 1016cm-3. Structural, spectroscopic, and electrical studies have confirmed the device quality of the grown films, which find potential application in the field of renewable energy.
AB - Copper Selenide thin films were grown by thermal evaporation method on glass substrate. The properties of the thin films were characterized by XRD, UV-Visible spectroscopy, SEM-EDS, and PL analysis. The uniformity and stoichiometry of the deposited films were confirmed by SEM-EDS analysis. The XRD results confirmed the cubic phase with prominent (1 1 1) orientation. The deposited films showed very low transmittance (∼20%) and direct band gap of about 2.35 eV. Further, PL spectra revealed the presence of defect states present in the films. The deposited films are p-type material with carrier density of 1.14 × 1016cm-3. Structural, spectroscopic, and electrical studies have confirmed the device quality of the grown films, which find potential application in the field of renewable energy.
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U2 - 10.1016/j.matpr.2021.11.644
DO - 10.1016/j.matpr.2021.11.644
M3 - Conference article
AN - SCOPUS:85126146656
SN - 2214-7853
VL - 55
SP - 22
EP - 25
JO - Materials Today: Proceedings
JF - Materials Today: Proceedings
T2 - 9th National Conference on Condensed Matter Physics and Applications, CMPA 2021
Y2 - 16 September 2021 through 17 September 2021
ER -
