TY - GEN
T1 - Design & performance analysis of Strained-Si NMOSFET using TCAD
AU - Martha, Pramod
AU - Hota, Aditya Kumar
AU - Sethi, Kabiraj
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/9/15
Y1 - 2016/9/15
N2 - Geometric Scaling and high channel doping incorporate loss in mobility. To compensate this, substrate engineering innovations like SOI(Silicon On Insulator) and strained silicon technologies are introduced. In this paper NMOS is designed on Strained Si/relaxed Si0.8Ge0.2 heterostructure using TCAD. Electrical analysis of Strained-Si nMOSFET has been done by the ATLAS 2D simulator using low field Arora mobility model. A mobility enhancement factor of 2.6 and transconductance enhancement of 100% at low voltage, compared to that of unstrained -Si control device at room temperature(300K) achieved in this work. Parasitic gate capacitance, the reason for the rise in the delay time has been reduced in the range of 10-15 F.
AB - Geometric Scaling and high channel doping incorporate loss in mobility. To compensate this, substrate engineering innovations like SOI(Silicon On Insulator) and strained silicon technologies are introduced. In this paper NMOS is designed on Strained Si/relaxed Si0.8Ge0.2 heterostructure using TCAD. Electrical analysis of Strained-Si nMOSFET has been done by the ATLAS 2D simulator using low field Arora mobility model. A mobility enhancement factor of 2.6 and transconductance enhancement of 100% at low voltage, compared to that of unstrained -Si control device at room temperature(300K) achieved in this work. Parasitic gate capacitance, the reason for the rise in the delay time has been reduced in the range of 10-15 F.
UR - https://www.scopus.com/pages/publications/84991782159
UR - https://www.scopus.com/pages/publications/84991782159#tab=citedBy
U2 - 10.1109/ICETECH.2016.7569390
DO - 10.1109/ICETECH.2016.7569390
M3 - Conference contribution
AN - SCOPUS:84991782159
T3 - Proceedings of 2nd IEEE International Conference on Engineering and Technology, ICETECH 2016
SP - 958
EP - 961
BT - Proceedings of 2nd IEEE International Conference on Engineering and Technology, ICETECH 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd IEEE International Conference on Engineering and Technology, ICETECH 2016
Y2 - 17 March 2016 through 18 March 2016
ER -