Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Cheng Chen Lin; Liann Be Chang; Ming Jer Jeng; Chia Yi Yen; Atanu Das; Chung Yi Tang; Ming Yi Tsai; Mu Jen Lai

doi:10.1016/j.microrel.2010.01.036

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Cheng Chen Lin^*
, Liann Be Chang
, Ming Jer Jeng
, Chia Yi Yen
, Atanu Das
, Chung Yi Tang
, Ming Yi Tsai
, Mu Jen Lai

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

20 Citations (Scopus)

Abstract

The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm² FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.

Original language	English
Pages (from-to)	683-687
Number of pages	5
Journal	Microelectronics Reliability
Volume	50
Issue number	5
DOIs	https://doi.org/10.1016/j.microrel.2010.01.036
Publication status	Published - 05-2010

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

Access to Document

10.1016/j.microrel.2010.01.036

Cite this

@article{0542a68ef723405aac8b1a115ec794a7,

title = "Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps",

abstract = "The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm2 FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.",

author = "Lin, \{Cheng Chen\} and Chang, \{Liann Be\} and Jeng, \{Ming Jer\} and Yen, \{Chia Yi\} and Atanu Das and Tang, \{Chung Yi\} and Tsai, \{Ming Yi\} and Lai, \{Mu Jen\}",

year = "2010",

month = may,

doi = "10.1016/j.microrel.2010.01.036",

language = "English",

volume = "50",

pages = "683--687",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd",

number = "5",

}

TY - JOUR

T1 - Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

AU - Lin, Cheng Chen

AU - Chang, Liann Be

AU - Jeng, Ming Jer

AU - Yen, Chia Yi

AU - Das, Atanu

AU - Tang, Chung Yi

AU - Tsai, Ming Yi

AU - Lai, Mu Jen

PY - 2010/5

Y1 - 2010/5

N2 - The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm2 FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.

AB - The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm2 FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.

UR - https://www.scopus.com/pages/publications/77953138268

UR - https://www.scopus.com/pages/publications/77953138268#tab=citedBy

U2 - 10.1016/j.microrel.2010.01.036

DO - 10.1016/j.microrel.2010.01.036

M3 - Article

AN - SCOPUS:77953138268

SN - 0026-2714

VL - 50

SP - 683

EP - 687

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 5

ER -

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this