TY - GEN
T1 - Performance Analysis of an Energy Efficient 1-Bit Hybrid Full Adder
AU - Devika, B.
AU - Dhathri, N.
AU - Priya Darshini, D.
AU - Sarayu, T.
AU - Sahoo, Satyajeet
AU - Samantaray, Aswini K.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper presents the design and analysis of hybrid adders utilizing transmission gate, CMOS logic, and pass transistor logic. In this work, simulation is conducted using 45nm technology. The adder architecture comprises three main modules: XOR, sum, and carry. The XOR module employs transmission gate logic and CMOS logic, while the sum module integrates transmission gate logic and XOR/XNOR operations. The carry module is built using pass transistor logic. An in-depth analysis was conducted on the designed hybrid adder circuit, with meticulous measurements and evaluations of its power consumption, delay, and power-delay product (PDP) to provide comprehensive insights into its performance and efficiency. The results demonstrate the effectiveness of the hybrid adder architecture in meeting the demands of modern digital systems while leveraging the benefits of advanced semiconductor manufacturing processes.
AB - This paper presents the design and analysis of hybrid adders utilizing transmission gate, CMOS logic, and pass transistor logic. In this work, simulation is conducted using 45nm technology. The adder architecture comprises three main modules: XOR, sum, and carry. The XOR module employs transmission gate logic and CMOS logic, while the sum module integrates transmission gate logic and XOR/XNOR operations. The carry module is built using pass transistor logic. An in-depth analysis was conducted on the designed hybrid adder circuit, with meticulous measurements and evaluations of its power consumption, delay, and power-delay product (PDP) to provide comprehensive insights into its performance and efficiency. The results demonstrate the effectiveness of the hybrid adder architecture in meeting the demands of modern digital systems while leveraging the benefits of advanced semiconductor manufacturing processes.
UR - https://www.scopus.com/pages/publications/85210418748
UR - https://www.scopus.com/pages/publications/85210418748#tab=citedBy
U2 - 10.1109/ICNEWS60873.2024.10730821
DO - 10.1109/ICNEWS60873.2024.10730821
M3 - Conference contribution
AN - SCOPUS:85210418748
T3 - Proceedings - ICNEWS 2024: 2nd International Conference on Networking, Embedded and Wireless Systems: Wireless Technology - Building a Digital World
BT - Proceedings - ICNEWS 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd International Conference on Networking, Embedded and Wireless Systems, ICNEWS 2024
Y2 - 22 August 2024 through 23 August 2024
ER -