TY - GEN
T1 - Self-Heating and Interface Traps Assisted Early Aging Revelation and Reliability Analysis of Negative Capacitance FinFET
AU - Jaisawal, Rajeewa Kumar
AU - Rathore, Sunil
AU - Gandhi, Navneet
AU - Kondekar, P. N.
AU - Banchhor, Shashank
AU - Sreenivas, V. Bharath
AU - Song, Young Suh
AU - Bagga, Navjeet
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - The realization of a Negative Capacitance (NC) phenomenon in TCAD, considering several realistic aspects of transport physics, remains challenging. In this paper, we investigated the aging and reliability of the NC-FinFET considering the self-heating effect (SHE) and interface trap charges with varying concentration and energy location. In general, the FEPolarization and hydrodynamic models cannot be coupled at the same simulation flow; thus, we employed the iterative approach. Due to SHE, the lattice temperature increases, which impacts the Landau parameters and, in turn, the NC behavior. Moreover, we also evaluated the impact of ambient temperature on device performance with and without (w/o) considering SHE.
AB - The realization of a Negative Capacitance (NC) phenomenon in TCAD, considering several realistic aspects of transport physics, remains challenging. In this paper, we investigated the aging and reliability of the NC-FinFET considering the self-heating effect (SHE) and interface trap charges with varying concentration and energy location. In general, the FEPolarization and hydrodynamic models cannot be coupled at the same simulation flow; thus, we employed the iterative approach. Due to SHE, the lattice temperature increases, which impacts the Landau parameters and, in turn, the NC behavior. Moreover, we also evaluated the impact of ambient temperature on device performance with and without (w/o) considering SHE.
UR - https://www.scopus.com/pages/publications/85158099767
UR - https://www.scopus.com/pages/publications/85158099767#tab=citedBy
U2 - 10.1109/EDTM55494.2023.10103127
DO - 10.1109/EDTM55494.2023.10103127
M3 - Conference contribution
AN - SCOPUS:85158099767
T3 - 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023
BT - 7th IEEE Electron Devices Technology and Manufacturing Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2023
Y2 - 7 March 2023 through 10 March 2023
ER -