TY - JOUR
T1 - Soldering of copper using graphene-phosphoric acid gel
AU - Puranik, Gurudatt
AU - Sarkar, Asis
AU - Mishra, Nirankar
AU - Gurumurthy, Sangam Chandrasekhar
AU - Mundinamani, Shridhar
N1 - Funding Information:
We thank Prof. G. U. Kulkarni, Director, CeNS, Bengaluru for his constant encouragement and support. We thank the Director, CEO, and Principal, Siddaganga Institute of Technology, Tumakuru, for continuous support and motivation. GP thanks Mr. Rajshekhar Pujar, Research Scholar, Centre for Nano and Soft Matter Sciences, Jalahalli, Bengaluru for the motivation. SM acknowledges the funding received from VGST, Govt of Karnataka. (VGST/GRD-585/2016-17/2017-18/39). AS and NM thanks to Karnataka Council for Technological Upgradation, Govt of Karnataka. (KCTU/R&D/SIT-Nano/2016- 17/399).
Funding Information:
We thank Prof. G. U. Kulkarni, Director, CeNS, Bengaluru for his constant encouragement and support. We thank the Director, CEO, and Principal, Siddaganga Institute of Technology, Tumakuru, for continuous support and motivation. GP thanks Mr. Rajshekhar Pujar, Research Scholar, Centre for Nano and Soft Matter Sciences, Jalahalli, Bengaluru for the motivation. SM acknowledges the funding received from VGST, Govt of Karnataka. (VGST/GRD-585/2016-17/2017-18/39). AS and NM thanks to Karnataka Council for Technological Upgradation, Govt of Karnataka. (KCTU/R&D/SIT-Nano/2016-17/399).
Publisher Copyright:
© 2020. All rights reserved.
PY - 2020
Y1 - 2020
N2 - Soldering is a physical process in which one metal melts and joins the other to form a strong bond, which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-step soldering of copper wire on to the surface of the copper-based printed circuit board. The soldering flux can be applied to the copper, and wire can be soldered in ambient conditions using commercial soldering iron at a standard soldering temperature of 260°C. This flux helps the formation of strong and electrically conducting joints between the copper wire and copper-based printed circuit board. The joints are studied with scanning electron microscope images, and energy dispersive X-ray mapping successfully shows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.
AB - Soldering is a physical process in which one metal melts and joins the other to form a strong bond, which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-step soldering of copper wire on to the surface of the copper-based printed circuit board. The soldering flux can be applied to the copper, and wire can be soldered in ambient conditions using commercial soldering iron at a standard soldering temperature of 260°C. This flux helps the formation of strong and electrically conducting joints between the copper wire and copper-based printed circuit board. The joints are studied with scanning electron microscope images, and energy dispersive X-ray mapping successfully shows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.
UR - https://www.scopus.com/pages/publications/85099963418
UR - https://www.scopus.com/pages/publications/85099963418#tab=citedBy
U2 - 10.14456/jmmm.2020.52
DO - 10.14456/jmmm.2020.52
M3 - Article
AN - SCOPUS:85099963418
SN - 0857-6149
VL - 30
SP - 60
EP - 67
JO - Journal of Metals, Materials and Minerals
JF - Journal of Metals, Materials and Minerals
IS - 4
ER -