@inproceedings{230a5732e7cc481fbf22a5beee07b89e,
title = "STLDAS: Secure Two Level Deduplication and Auditing of Shared Data in Cloud",
abstract = "With the cloud repository service furnished by the cloud computing, users can comfortably arrange themselves as a cluster and distribute information effectively. In order to empower public verifier to audit the distributed information, clients in the cluster need to Figure out signatures on complete chunks of collaborative information. Every client in the cluster modifies and signs his respective chunks, and deploys in the cloud server. Hence specific chunks of shared information are normally signed by specific clients. If anyone of the customers' is found malicious, he is immediately repudiated from the cluster. The prevailing clients in the cluster are permitted to re-sign the chunks that were earlier signed by this eliminated client. This approach is inefficient due to the massive amount of collaborative information in the cloud. By exploiting the approach of proxy re-signatures, the CSP is acknowledged to re-sign chunks in support of the prevailing clients during customer repudiation. When many clients deploy the same information to the cloud repository, repository space has identical copies, hence deduplication technology is usually utilized to lower the capacity and bandwidth prerequisites of the utilities by removing repetitious information and hoarding only an original replica of them. In order to assimilate both data honesty and deduplication in cloud, we present a novel Secure Two Level Deduplication and Auditing of Shared Data in Cloud (STLDAS) mechanism. Experimental results show that our mechanism achieves secure deduplication and appreciable improvement in tag generation.",
author = "Geeta, {C. M.} and {Mithila Lakshmi}, G. and {Shreyas Raju}, {R. G.} and S. Raghavendra and Rajkumar Buyya and Venugopal, {K. R.} and Iyengar, {S. S.} and Patnaik, {L. M.}",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE Region 10 Symposium, TENSYMP 2019 ; Conference date: 07-06-2019 Through 09-06-2019",
year = "2019",
month = jun,
doi = "10.1109/TENSYMP46218.2019.8971331",
language = "English",
series = "Proceedings of 2019 IEEE Region 10 Symposium, TENSYMP 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "698--703",
booktitle = "Proceedings of 2019 IEEE Region 10 Symposium, TENSYMP 2019",
address = "United States",
}