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Study on effect of thermo-structural loading on the PCB during Selective Soldering process using finite element method
- Subraya Krishna Bhat
- , Raghavendra Deshpande
- , Peter Beck
- , Sudarshan Hegde
- , Y. S. Upadhyaya
- , Chandan Kumar Ghosh
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3
Citations
(Scopus)