TY - JOUR
T1 - Tailoring the surface microstructure and texture in pure zinc
AU - Gokhale, Aditya
AU - Sarvesha, R.
AU - Guruprasad, T. S.
AU - Singh, Sudhanshu S.
AU - Jain, Jayant
N1 - Funding Information:
The authors are thankful for the financial support from IIT Kanpur for carrying out this work. We acknowledge the Electron Microscopy Facility support at the Advanced Center of Materials Science (ACMS) at IIT Kanpur for characterization.
Publisher Copyright:
© 2021 Elsevier B.V.
PY - 2021/6/1
Y1 - 2021/6/1
N2 - The present study focuses on the microstructure and texture evolution of a severely plastically deformed (SPD) surface of an extruded pure zinc. The SPD was carried out by indentation scratch on a surface perpendicular to extrusion direction at room temperature (RT) and high temperature (HT) of 150 °C. Different deformation mechanisms viz. slip lines, twin, grain boundary sliding, and dynamic recrystallization were noticed. Slip trace analysis confirmed basal slip {0001}112‾0 to be predominant. The dynamic recrystallization resulted in a massive grain size reduction from an initial size of ~ 86 μm to ~ 0.6–2.2 μm. Electron backscattered diffraction (EBSD) study showed that the recrystallized grains have a strong basal texture. The in-grain misorientation axes (IGMA) analysis indicated the activation of basal and/or second-order pyramidal slip. Additionally, profuse {101‾2}101‾1‾ contraction twins were observed for RT scratch, and the twin activity considerably diminished at HT. Further, {101‾2}/{101‾2} double twinning was observed in RT scratches. Finally, finite element simulation was used to characterize the stress distribution during RT scratch and predict the depth profile.
AB - The present study focuses on the microstructure and texture evolution of a severely plastically deformed (SPD) surface of an extruded pure zinc. The SPD was carried out by indentation scratch on a surface perpendicular to extrusion direction at room temperature (RT) and high temperature (HT) of 150 °C. Different deformation mechanisms viz. slip lines, twin, grain boundary sliding, and dynamic recrystallization were noticed. Slip trace analysis confirmed basal slip {0001}112‾0 to be predominant. The dynamic recrystallization resulted in a massive grain size reduction from an initial size of ~ 86 μm to ~ 0.6–2.2 μm. Electron backscattered diffraction (EBSD) study showed that the recrystallized grains have a strong basal texture. The in-grain misorientation axes (IGMA) analysis indicated the activation of basal and/or second-order pyramidal slip. Additionally, profuse {101‾2}101‾1‾ contraction twins were observed for RT scratch, and the twin activity considerably diminished at HT. Further, {101‾2}/{101‾2} double twinning was observed in RT scratches. Finally, finite element simulation was used to characterize the stress distribution during RT scratch and predict the depth profile.
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U2 - 10.1016/j.msea.2021.141258
DO - 10.1016/j.msea.2021.141258
M3 - Article
AN - SCOPUS:85105698602
SN - 0921-5093
VL - 816
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
M1 - 141258
ER -