Thermal annealing effect on phase evolution, physical properties of DC sputtered copper oxide thin films and transport behavior of ITO/CuO/Al Schottky diodes

K. A. Jagadish, Dhananjaya Kekuda

Research output: Contribution to journalArticlepeer-review

Abstract

Herein, we report on the post-annealing temperature effect on the transport behavior of p-CuO/Al Schottky barrier diodes. In addition, the transformation of phase from Cu4O3 to CuO phase was studied. Copper oxide thin films were grown on soda lime glass substrates, and post-annealing temperature's influence on the films’ structural, chemical, morphological, and electrical characteristics was comprehensively examined. X-ray diffraction study revealed the development of polycrystalline tenorite phase (CuO) on annealing. Raman analysis also confirmed the formation of the tenorite phase (CuO) at higher annealing temperatures (400 °C and 500 °C). XPS study revealed the occurrence of the Cu4O3 phase for room temperature deposited sample and CuO phase at the higher annealing temperature. Using current–voltage analysis, the Chueng model, and the thermoelectric emission model, the Schottky behavior between the metal and semiconductor were investigated. The fabricated diode showed a rectification ratio of 103 at ± 2 V, with the barrier height ranging from 0.84 to 1.12 eV due to different annealing treatments. The attributes of the power law were employed to elucidate space charge-limited conduction and the process of tunneling across the density of interface traps in p-CuO/Al Schottky diodes. This study provides valuable insights into the behavior of the p-CuO/Al Schottky junction, enhancing our understanding of its characteristics.

Original languageEnglish
Article number315
JournalApplied Physics A: Materials Science and Processing
Volume130
Issue number5
DOIs
Publication statusPublished - 05-2024

All Science Journal Classification (ASJC) codes

  • General Chemistry
  • General Materials Science

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